Taiwan Semiconductor Manufacturing Co., Ltd.
Capital Structure
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in mil. unless spec.Company Description
- CEO
- Che Chia Wei
- Full Time Employees
- 76,907
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- Hsinchu Science Park Hsinchu TPE Taiwan 300096
- IPO Date
- Sep 5, 1994
- Website
- tsmc.com
- Similar Companies
- Business
- Taiwan Semiconductor Manufacturing Company Limited (TSMC) operates as the world's largest dedicated independent semiconductor foundry, manufacturing advanced integrated circuits using process technologies from 2 microns to 3 nanometers for fabless semiconductor firms, integrated device manufacturers, and system companies; its core offerings encompass wafer manufacturing, wafer probing, assembly, testing, mask production, design services, advanced logic nodes including 5nm, 3nm families like N3E and N3P, forthcoming 2nm N2, specialty technologies for automotive, IoT, consumer electronics, industrial, and power management applications, and advanced packaging solutions such as Integrated Fan-Out (InFO), Chip on Wafer on Substrate (CoWoS), and silicon stacking. The company, founded in 1987 and headquartered in Taiwan's Hsinchu Science Park, maintains primary operations in Taiwan with global facilities in the United States (Arizona and Washington), Japan (Kumamoto via Japan Advanced Semiconductor Manufacturing joint venture with Sony and Denso), Germany (Dresden via European Semiconductor Manufacturing Company with Bosch, Infineon, and NXP), China (Nanjing and Shanghai), and Singapore, serving customers across high-performance computing, smartphones, data centers, telecommunications, automotive, and consumer electronics sectors primarily in North America (68% of 2024 sales), China, Taiwan, Japan, and Europe. Recent developments include securing $2.23 billion in global subsidies in H1 2025 from the US, Germany, Japan, and China to fund expansions like a third Arizona fab for 2nm and A16 processes, plans for three additional 2nm factories in Taiwan amid surging AI chip demand, acquisition of an Innolux plant in 2024 for $531 million to enhance CoWoS packaging capacity, accelerated construction of a 1.4nm fab with trial production slated for 2027, and a $100 billion commitment for further US fabs, assembly, and R&D following partnerships such as the TSMC-University of Tokyo Lab established in June 2025.
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